Engineering Portfolio
Dyve
February 2021 - September 2021
Dyve is a startup created by a fellow swimmer and high school friend of mine, Kevin Han. Kevin noticed that there were no tools in the market in which swimmers could use to analyze their swims, so he decided to create Dyve. Dyve is a product that is attached to a swimmer via placement in the cap or swimsuit and records data about their swim. Dyve uses a sensor that contains a magnetometer, gyroscope, and accelerometer to record magnetic field data, angular velocity, and raw acceleration. The data is then processed by the Dyve software and can be seen in the user interface and then is used by coaches and swimmers to analyze swims and determine room for improvement for the swimmer. We are still in the process of releasing the website and application of the finalized product.
So where do I come in? Well, we had the sensor, but we had no practical way of waterproofing it. This is when Kevin recruited me to design a waterproof case for the sensor through 3-D modeling and printing. Using my previous experience with SolidWorks, I continuously take input from Kevin to deliver the iterations of Dyve you will see below.
Kevin attends UC Berkeley which is quite far from Purdue. This physical distance challenges our ability to collaborate in a virtual setting. Through digital communication, we have produced the majority of the models seen below and continue to make improvements. This project continues to provide me with valuable engineering-design process experience by allowing me to collaborate with teammates and use my applicable skills.
UPDATE: Unfortunately, this project has come to an end. Throughout this process, I have sharpened my CAD and collaboration skills and will continue to use these skills in future endeavors.
The Sensor



Here, we can see a model of the sensor we are working with. It is rather small, with a diameter of about 24 mm and a max height of about 7 mm. The series of holes on the one side indicate that that is the front of the sensor. The large cylindrical shape on the underside of the chip is the battery.
Brainstorming
I began with brainstorming different concepts for the case. As you can see, I thought of two different types of gaskets that could be used, either a flat or O-ring gasket. We decided to go with the rounded because it was more available in the market. I also decided that the fastening system to be used would be small bolts and nuts. From here, I began working on the first iteration.




Iteration 1


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The features introduced in this initial concept are (1) a gasket groove, (2) holes for screws, and (3) pillars and a leveled surface to guide and hold the chip in place.
Below, you can see the printed versions and an image of the sensor sitting in the sensor bed of the case.
Issues with this iteration:
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Lid and base of casing were too thin
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Difficulty inserting and removing the sensor
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Chip is able to move up and down within case
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No way of knowing which direction is front when the lid is on


Iteration 2


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After analyzing the issues we had with the last iteration, we decided to make some improvements. These improvements include (1) a pointed side to indicate the front, (2) angled walls for easier insertion and removal of the chip, and (3) extrusion on the lid to assist in keeping the chip still while the lid is closed. I also adjusted the dimensions of the sensor bed slightly to allow for a better fit.
There were no major issues regarding the compatibility between the chip and case for this iteration, meaning we had gotten the dimensions we needed for the sensor bed. All we had left was to make the case more visually appealing and more ergonomic for the user.

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Iteration 3 and 4

Iteration 3 and iteration 4 are nearly identical in design, the only difference being the gasket groove. Iteration 3 uses the gasket groove from previous iterations in which the groove is found on both the lid and the bottom casing whereas it is only found on the bottom casing in iteration 4 (all of the images seen here are iteration 4).
For now, iteration 4 is the final design of Dyve. I completely revamped the appearance of the case by changing the overall shape. Improvements for this iteration include (1) holes on the inside of the casing to indicate sensor orientation, (2) "Dyve" text at various locations, (3) beveled edges to avoid discomfort for user, (4) gasket groove moved to only bottom casing, (5) enlarged screw holes to accommodate for M3 sized screws, (6) counterbores to allow a better fit for screws and nuts, and (7) a smaller extrusion on the bottom of the lid to better hold the sensor inside.
The bottom images include examples of the chip sitting within the sensor bed. Notice that in the CAD model, there is a noticeable gap between the chip and the inside walls of the model. This is for error tolerancing due to the fact that the printer cannot print the exact dimensions of the model.

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While the design process for the case is nearly finished, we are far from done. We still need to perform more rigorous testing and finish the backend of the product before it is released. This means that we must test the waterproofing and data collection of the case and sensor and also complete the Dyve software. Overall, through the process of designing this case, my eyes have been opened to the steps of creating a product through ideation, testing, and improving. It was satisfying to see my CAD experience put to use in a legitimate application.
UPDATE: Unfortunately, this project has come to an end. Throughout this process, I have sharpened my CAD and collaboration skills and will continue to use these skills in future endeavors.